this is information on a product in full production. november 2013 docid16007 rev 3 1/9 1n5822u aerospace 40 v power schottky rectifier datasheet - production data features ? aerospace applications ? surface mount hermetic package ? high thermal conduct ivity materials ? very small conduction losses ? negligible switching losses ? extremely fast switching ? low forward voltage drop ? package mass: 0.18 g ? target radiation qualification ? 150 krad (si) low dose rate ? 3 mrad (si) high dose rate ? escc qualified description this power schottky rectifier is designed and packaged to comply with the escc5000 specification for aerospace products. it is housed in a surface mount hermetically sealed lcc2b package whose footprint is 100% compatible with industry standard solutions in d5b. the 1n5822u is suitable for switching mode power supplies and high frequency dc to dc converters such as low voltage high frequency inverter, free wheeling or polarity protection. a k k a leadless chip carrier 2 (lcc2b) table 1. device summary (1) order code escc detailed specification quality level lead finish eppl i f(av) v rrm t j(max) vf (max) 1n5822ub1 engineering model gold 3 40 150 0.485 1N5822U01B 5106/020/01 escc gold yes 1n5822u02b 5106/020/02 escc solder dip 1. contact st sales office for information about th e specific conditions fo r products in die form. www.st.com
characteristics 1n5822u 2/9 docid16007 rev 3 1 characteristics to evaluate the conduction loss es use the following equation: p = 0.32 x if(av) + 0.050 x i f 2 (rms ) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 40 v i f(rms) forward rms current 10 a i f(av) average forward rectified current t c 139 c ?? = 0.5 3 a i fsm forward surge current t p = 10 ms sinusoidal 80 a t stg storage temperature range -65 to +150 c t j maximum operating junction temperature (1) 150 c t sol maximum soldering temperature (2) 245 c 1. condition to avoid thermal runaway for a diode on its own heatsink 2. maximum duration 5 s. the same package must not be re-soldered until 3 minutes have elapsed. table 3. thermal resistance symbol parameter value unit r th (j-c) junction to case 7 ? c/w dptot dtj --------------- 1 rth j a ? ?? ------------------------- - ? table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit i r (1) reverse current t j = -55 c v r = 40 v --40 a t j = 25 c - - 80 t j = 100 c - - 12 ma v f (2) forward voltage t j = 25 ? c i f = 1a - - 0.4 v t j = -55 ? c i f = 3 a - - 0.56 t j = 25 ? c - - 0.485 t j = 100 ? c - - 0.455 t j = 25 ? c i f = 9.4 a - - 0.70 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 680 s, < 2% table 5. dynamic characteristics symbol parameter test conditions min. typ. max. unit c j diode capacitance v r = 5 v, f = 1 mhz - - 240 pf
docid16007 rev 3 3/9 1n5822u characteristics 9 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( ? = 0.5) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 =0.05 =0.1 =0.2 =0.5 =1 t =tp/t tp if(av) (a) pf(av)(w) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 r th(j-a) =r th(j-c) t =tp/t tp r th(j-a) =120 c/w if(av)(a) tamb(c) 0 5 10 15 20 25 30 35 40 45 50 1.e-03 1.e-02 1.e-01 1.e+00 t c =25 c t c =75 c t c =125 c i m t =0.5 t(s) im(a) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse zth(j-c)/rth(j-c) tp(s) figure 5. reverse leakage current versus reverse voltage applied (typical values) figure 6. forward voltage drop versus forward current (typical values) 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 t j =125c t j =25c t j =50c t j =75c t j =100c t j =150c ir(ma) vr(v) 0.01 0.10 1.00 10.00 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 t j =25c t j =125c t j =100c vfm(v) ifm(a)
characteristics 1n5822u 4/9 docid16007 rev 3 figure 7. non repetitive surge peak forward current versus number of cycles 0 20 40 60 80 100 1 10 100 1000 f=50 hz t j initial =25c number of cycles ifsm(a)
docid16007 rev 3 5/9 1n5822u package information 9 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. leadless chip carrier 2 (lcc2b) package dimension definitions 1. the anode is identified by metalization in two top internal angles and the index mark. pin 2 cathode pin 1 anode 2 1 2 1 r2 r1 g i h e e note 1 note 1 note 1 f d a b c
package information 1n5822u 6/9 docid16007 rev 3 table 6. leadless chip carrier 2 (lcc2b) package dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a (1) 1. measurement prior to solder coati ng the mounting pads on bottom of package 2.04 2.23 2.42 0.080 0.088 0.095 b 5.27 5.4 5.6 0.207 0.213 0.220 c 3.49 3.62 3.76 0.137 0.143 0.148 d 1.71 1.90 2.09 0.067 0.075 0.082 e 0.48 - 0.71 0.019 - 0.028 f- 1.4 - - 0.055 - g - 3.32 - - 0.131 - h - 1.82 - - 0.072 - i - 0.15 - - 0.006 - r1 - 0.15 - - 0.006 - r2 - 0.20 - - 0.008 -
docid16007 rev 3 7/9 1n5822u ordering information 9 3 ordering information 4 other information 4.1 date code date code is structured as describe below: ? em xyywwz ? escc flight yywwz where: ? x (em only): 3, assembly location rennes (france) ? yy: last two digits year ? ww: week digits ? z: lot index in the week 4.2 documentation in table 8 is a summary of the documentation provided with each type of products. table 7. ordering information (1) 1. contact st sales office for information about t he specific conditions fo r products in die form. order code escc detailed specification package lead finish marking (2) 2. specific marking only. the fu ll marking includes in addition: for the engineering models: st logo, date code, country of origin (fr). for escc flight parts: st logo, date code, country of orig in (fr), esa logo, serial number of the part within the assembly lot. eppl mass packing 1n5822ub1 lcc2b gold 5822 - 0.18 g waffle pack 1N5822U01B 5106/020/01 gold 510602001 y 1n5822u02b 5106/020/02 solder dip 510602002 - table 8. documentation provided with each type of products quality level documentation engineering model escc flight certificat e of conformance
revision history 1n5822u 8/9 docid16007 rev 3 5 revision history table 9. document revision history date revision changes 10-aug-2009 1 first issue. 25-sep-2011 2 updated escc status in features and added footnote to table 3 . 8-nov-2013 3 updated table 1 , table 2 , ta ble 5 and ta ble 7 and inserted other information .
docid16007 rev 3 9/9 1n5822u 9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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